The Structured Laser Beam represents a new paradigm in the creation of non-diffractive beams (NDBs) and it has the potential to greatly improve a number of mainstream applications using laser beams or light beams.

The new invention solves the problem of precisely mounting a cantilever to a structure in a vaccum tight, radiation hard way, where no further alignments are needed.

The 3D Magnetic Sensor Calibrator is an innovative device for calibrating magnetic field with high resolution.

CERN developed the orbital cutting machine for repair of awkwardly located pipes in tight spaces. It is relevant for the industrial piping needs of accelerator facilities, as well as in sectors with environmental hazards, such as oil and gas piping, heat exchangers, and piping in nuclear plants.

The Medipix2 ASIC is a high spatial, high contrast resolving CMOS pixel read-out chip working in single photon counting mode.

Innovative Graphite Composites for Thermal Management Applications

Chemical Via is a new chemical method to make microvias for high density printed multilayer circuits.

The PicoTDC is a specially developed 64 channel Time to Digital Converter (TDC) ASIC in 65nm CMOS for use in High Energy Physics (HEP) experiments and similar scientific applications.

Timepix4 is a programmable general purpose hybrid pixel detector readout ASIC, with a larger chip area and improved time stamp precision and hit rate capability in comparison to its predecessor, Timepix3. The Timepix4 ASIC consists of a matrix of 448 x 512 pixels with a pixel pitch of 55μm. By utilising Through-Silicon-Via (TSV) technology, the ASIC has been designed to be 4-side buttable, permitting almost seamless tiling on all 4 sides. The detector can be applied to a wide range of applications including X-ray imaging, particle tracking and material analysis.